at least to me......
u-blox's history in cellular M2M is pretty short...from 2009 when they acquired NeonSeven....who was a key partner for Infineon. Infineon began pushing customers to Telit (unlicensed) and u-blox for cellular M2M solutions. Maybe there is some *potential*...I say potential 3G stack revenue...with the expectation we'll work things out with Intel/Infineon.
u-blox will continue to ship 2G GSM as a majority of their solutions....but eventually 3G will take over the volume. Also of interest is their acquisition of Fusion Wireless...who was making CDMA modules....based on VIA Telecom's CDMA chipsets...and not Qualcomm's.
but yes....without some guidance from the company...it's hard for the market to value this relationship. Gimme 50 little guys that contribute a mil or 2 a year....good money that drops to the bottom line.
u-blox
u-blox (Thalwil, Switzerland), a publicly traded company founded in 1997, has about 200 employees, and regional offices in Italy, United Kingdom, United States, Singapore, Hong Kong,
China, Taiwan, South Korea, and Japan. Primarily a GPS module supplier, the company utilizes
its own GPS chipset, but sells the GPS in module form. Increasingly, customers in the
automotive sector asked u-blox for a cellular connectivity solution to complement the GPS
module products.
u-blox acquired cellular design house NeonSeven in February 2009. NeonSeven provided
design services to both cellular handset as well as modules suppliers, based from Infineon
cellular baseband chipsets. One of these reference designs formed the basis for the u-blox
LEON GSM/GPRS module product introduced in February 2009, as well as the LUCY
UMTS/HSPA module family introduced in January 2010. The LEON product went into volume
production in 4Q 2009.
The vast majority of u-blox customers are in the automotive segment. The company
differentiates itself through tight integration of GPS and cellular connectivity for customers who
want this, as well as granular control over the protocol stack, through its close partnership with
Infineon AG. In addition, the modules come in a surface-mounted design with the pins positioned
to the side of the module, rather than underneath the module, as is the case with BGA and LGA
form factors. This means that the u-blox modules can be optically inspected and easily removed
from and re-soldered to the end-device motherboard.
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